... | ... | @@ -73,40 +73,40 @@ The mainboard can be soldered by hand but the fine pitch components make this di |
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1. Apply a small quantity of solder paste to each pad on the front of the PCB.
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Pads for fine-pitch components can be covered with a continuous line of paste for each side—the surface tension of the melted solder will remove most solder bridges once heated.
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![PCB with paste](images/PCB_paste1.jpg)
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![PCB with paste](images/PCB_paste2.jpg)
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![PCB with paste](images/PCB_paste1.jpg)
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![PCB with paste](images/PCB_paste2.jpg)
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1. Using tweezers, carefully populate the front of the PCB with surface mount components, making sure of the correct orientation of ICs. (Match the corner of the IC marked with a dot with the corresponding mark on the PCB)
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The solder paste will help keep the components in place.
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Perfect alignment isn't necessary as the surface tension of the solder will center the components once melted.
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Perfect alignment isn't necessary as the surface tension of the solder will centre the components once melted.
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![PCB with components](images/PCB_parts.jpg)
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![PCB with components](images/PCB_parts.jpg)
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1. Heat the PCB on a hotplate following the recommended temperature profile for your soldermask.
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Remove once cooled.
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![PCB on hotplate](images/PCB_hotplate.jpg)
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![PCB on hotplate](images/PCB_hotplate.jpg)
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1. Inspect the front of the PCB for solder paste which has not completely melted, components that are not soldered to their pads, and pins on components that are bridged together with excess solder. (optical magnification is useful)
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Defects can be corrected with a soldering iron by applying heat to single pins or removing excess solder with solder wick.
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![IC with bridged pins](images/PCB_bridged_pins.jpg)
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![IC with bridged pins](images/PCB_bridged_pins.jpg)
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1. Solder the remaining components to the PCB by hand.
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These include surface mount components on the back of the PCB and components that sit in holes (pin headers).
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![Pin headers](images/PCB_through_hole.jpg)
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![Back components](images/PCB_back.jpg_)
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![Pin headers](images/PCB_through_hole.jpg)
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![Back components](images/PCB_back.jpg)
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1. Clean flux off the PCB using a suitable solvent, rubbing the surface of the board with a swab.
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Especially if using water, ensure the board is completely dry before proceeding.
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![PCB cleaning](images/PCB_cleaning.jpg)
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![PCB cleaning](images/PCB_clean.jpg)
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1. Before attempting connection of the instrument, check for shorts from the power rails to ground using the multimeter. (The P8 connector provides both power rails and ground)
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If any shorts are found, inspect components for solder bridges.
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![Finished Board](images/PCB_finished.jpg)
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![Finished Board](images/PCB_finished.jpg)
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# Connections
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| Connector | Function |
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... | ... | @@ -140,7 +140,7 @@ For a standard 3-electrode cell, Working, Counter, and Reference electrodes conn |
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Switches U3A, U3C, and U3D should be closed during measurements.
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# License Information
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This wiki, the hardware schematics and layouts, and all other documentation describing the DStat hardware is licensed under the [CERN OHL v. 1.2.](LICENSE/LICENSE.pdf)
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This wiki, the hardware schematics and layouts, and all other documentation describing the DStat hardware are licensed under the [CERN OHL v. 1.2.](LICENSE/LICENSE.pdf)
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©Michael D. M. Dryden 2014
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You may redistribute and modify this documentation under the terms of the CERN OHL v.1.2. (http://ohwr.org/cernohl).
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